Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
24-C300-20

24-C300-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,557 19.08

RFQ

24-C300-20

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-C300-30

24-C300-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,413 19.08

RFQ

24-C300-30

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
111-43-310-61-001000

111-43-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,394 19.08

RFQ

Tube * Active - - - - - - - - - - - - - -
111-93-310-61-001000

111-93-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,731 19.08

RFQ

Tube * Active - - - - - - - - - - - - - -
32-6556-11

32-6556-11

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,475 19.09

RFQ

32-6556-11

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
115-43-306-61-001000

115-43-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,180 19.11

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-306-61-001000

115-93-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,477 19.11

RFQ

Tube * Active - - - - - - - - - - - - - -
36-6820-90C

36-6820-90C

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,842 19.11

RFQ

36-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-6822-90C

36-6822-90C

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,781 19.11

RFQ

36-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-6823-90C

36-6823-90C

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,378 19.11

RFQ

36-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-0501-21

34-0501-21

CONN SOCKET SIP 34POS GOLD

Aries Electronics

2,548 19.11

RFQ

34-0501-21

Datasheet

Bulk 501 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-0501-31

34-0501-31

CONN SOCKET SIP 34POS GOLD

Aries Electronics

2,606 19.11

RFQ

34-0501-31

Datasheet

Bulk 501 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
550-80-191-18-091101

550-80-191-18-091101

PGA SOLDER TAIL

Preci-Dip

3,385 18.09

RFQ

550-80-191-18-091101

Datasheet

Bulk 550 Active PGA 191 (18 x 18) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-93-652-41-001000

123-93-652-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

3,109 19.12

RFQ

123-93-652-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-652-41-001000

123-43-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,390 19.12

RFQ

123-43-652-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-11-640-41-001000

123-11-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,621 19.12

RFQ

123-11-640-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-952-41-008000

116-41-952-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,938 19.13

RFQ

116-41-952-41-008000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-952-41-008000

116-91-952-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,823 19.13

RFQ

116-91-952-41-008000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-87-181-15-051112

614-87-181-15-051112

CONN SOCKET PGA 181POS GOLD

Preci-Dip

2,305 18.10

RFQ

614-87-181-15-051112

Datasheet

Bulk 614 Active PGA 181 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
26-0508-21

26-0508-21

CONN SOCKET SIP 26POS GOLD

Aries Electronics

3,054 19.13

RFQ

26-0508-21

Datasheet

Bulk 508 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
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