Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
38-3513-11H

38-3513-11H

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2,286 19.20

RFQ

38-3513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
117-41-664-41-105000

117-41-664-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,308 19.20

RFQ

117-41-664-41-105000

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-41-764-41-105000

117-41-764-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,681 19.20

RFQ

117-41-764-41-105000

Datasheet

Tube 117 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
315-13-164-41-001000

315-13-164-41-001000

SOCKET LOW PROFILE SIP 64POS

Mill-Max Manufacturing Corp.

2,481 19.21

RFQ

Tube 315 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-952-41-780000

104-11-952-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,364 19.21

RFQ

104-11-952-41-780000

Datasheet

Tube 104 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
326-93-132-41-003000

326-93-132-41-003000

SOCKET WRAP SOLDERTAIL SIP 32POS

Mill-Max Manufacturing Corp.

2,377 19.21

RFQ

326-93-132-41-003000

Datasheet

Tube 326 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-100-10-000001

510-93-100-10-000001

SOCKET SOLDERTAIL 100-PGA

Mill-Max Manufacturing Corp.

2,791 19.21

RFQ

510-93-100-10-000001

Datasheet

Tube 510 Active PGA 100 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-100-13-062001

510-93-100-13-062001

SOCKET SOLDERTAIL 100-PGA

Mill-Max Manufacturing Corp.

2,824 19.21

RFQ

Tube 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-93-640-41-002000

124-93-640-41-002000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

3,747 19.21

RFQ

124-93-640-41-002000

Datasheet

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-43-640-41-002000

124-43-640-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,261 19.21

RFQ

124-43-640-41-002000

Datasheet

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-648-41-001000

612-93-648-41-001000

SOCKET CARRIER SLDRTL .600 48POS

Mill-Max Manufacturing Corp.

2,068 19.21

RFQ

612-93-648-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-648-41-001000

612-43-648-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,554 19.21

RFQ

612-43-648-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
31-7400-10

31-7400-10

CONN SOCKET SIP 31POS TIN

Aries Electronics

3,569 19.22

RFQ

31-7400-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 31 (1 x 31) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
31-7440-10

31-7440-10

CONN SOCKET SIP 31POS TIN

Aries Electronics

3,181 19.22

RFQ

31-7440-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 31 (1 x 31) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
31-7500-10

31-7500-10

CONN SOCKET SIP 31POS TIN

Aries Electronics

3,197 19.22

RFQ

31-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 31 (1 x 31) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-212

16-3508-212

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,443 19.22

RFQ

16-3508-212

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-312

16-3508-312

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,624 19.22

RFQ

16-3508-312

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-43-210-61-001000

115-43-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,790 19.22

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-210-61-001000

115-93-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,078 19.22

RFQ

Tube * Active - - - - - - - - - - - - - -
36-3570-10

36-3570-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,020 19.23

RFQ

36-3570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
Total 21991 Records«Prev1... 539540541542543544545546...1100Next»
Help you to save your Cost and time.
Help you to save your Cost and time.
Reliable package for your goods.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Fast Reliable Delivery to save time.
Quality premium After-sale service.
Quality premium After-sale service.
Chip Easy Buy (HK) Technology Co.LTD

HOME

Chip Easy Buy (HK) Technology Co.LTD

PRODUCT

Chip Easy Buy (HK) Technology Co.LTD

PHONE

Chip Easy Buy (HK) Technology Co.LTD

USER