Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
42-6556-30

42-6556-30

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

3,525 18.85

RFQ

42-6556-30

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
42-6556-20

42-6556-20

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

3,030 18.85

RFQ

42-6556-20

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
28-6621-30

28-6621-30

CONN IC DIP SOCKET 28POS TIN

Aries Electronics

2,577 18.85

RFQ

28-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
132-PGM14015-10

132-PGM14015-10

CONN SOCKET PGA GOLD

Aries Electronics

3,793 18.86

RFQ

132-PGM14015-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
132-PGM14016-10

132-PGM14016-10

CONN SOCKET PGA GOLD

Aries Electronics

3,233 18.86

RFQ

132-PGM14016-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-11-642-41-001000

612-11-642-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,788 18.86

RFQ

612-11-642-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-950-41-008000

116-41-950-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,240 18.87

RFQ

116-41-950-41-008000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-950-41-008000

116-91-950-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,836 18.87

RFQ

116-91-950-41-008000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
29-0501-21

29-0501-21

CONN SOCKET SIP 29POS GOLD

Aries Electronics

3,459 18.87

RFQ

29-0501-21

Datasheet

Bulk 501 Active SIP 29 (1 x 29) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
29-0501-31

29-0501-31

CONN SOCKET SIP 29POS GOLD

Aries Electronics

2,787 18.87

RFQ

29-0501-31

Datasheet

Bulk 501 Active SIP 29 (1 x 29) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
38-0501-20

38-0501-20

CONN SOCKET SIP 38POS TIN

Aries Electronics

3,557 18.87

RFQ

38-0501-20

Datasheet

Bulk 501 Active SIP 38 (1 x 38) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
38-0501-30

38-0501-30

CONN SOCKET SIP 38POS TIN

Aries Electronics

3,424 18.87

RFQ

38-0501-30

Datasheet

Bulk 501 Active SIP 38 (1 x 38) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
123-43-632-41-801000

123-43-632-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,450 18.89

RFQ

123-43-632-41-801000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-632-41-801000

123-93-632-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,977 18.89

RFQ

123-93-632-41-801000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-310-61-001000

115-43-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,537 18.89

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-310-61-001000

115-93-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,753 18.89

RFQ

Tube * Active - - - - - - - - - - - - - -
23-0503-21

23-0503-21

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2,153 18.90

RFQ

23-0503-21

Datasheet

Bulk 0503 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
23-0503-31

23-0503-31

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2,508 18.90

RFQ

23-0503-31

Datasheet

Bulk 0503 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
133-PGM13046-10

133-PGM13046-10

CONN SOCKET PGA GOLD

Aries Electronics

2,080 18.90

RFQ

133-PGM13046-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
133-PGM14013-10

133-PGM14013-10

CONN SOCKET PGA GOLD

Aries Electronics

2,875 18.90

RFQ

133-PGM14013-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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