| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|   | 110-99-632-61-001000CONN IC SKT DBL | 2,518 | 16.83 | RFQ | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|   | 117-43-642-41-105000CONN IC SKT DBL | 3,648 | 16.84 | RFQ |   Datasheet | Tube | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 124-93-328-41-002000CONN IC DIP SOCKET 28POS GOLD | 2,690 | 16.84 | RFQ |   Datasheet | Tube | 124 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 124-93-428-41-002000CONN IC DIP SOCKET 28POS GOLD | 2,503 | 16.84 | RFQ |   Datasheet | Tube | 124 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 614-41-432-41-001000SKT CARRIER PGA | 2,444 | 16.84 | RFQ |   Datasheet | Tube | 614 | Active | DIP, 0.4 (10.16mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 614-41-632-41-001000SKT CARRIER PGA | 2,711 | 16.84 | RFQ |   Datasheet | Tube | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 614-91-432-41-001000SKT CARRIER PGA | 2,225 | 16.84 | RFQ |   Datasheet | Tube | 614 | Active | DIP, 0.4 (10.16mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 614-91-632-41-001000SKT CARRIER PGA | 2,992 | 16.84 | RFQ |   Datasheet | Tube | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 22-0501-21CONN SOCKET SIP 22POS GOLD | 2,284 | 16.84 | RFQ |   Datasheet | Bulk | 501 | Active | SIP | 22 (1 x 22) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | 
|   | 22-0501-31CONN SOCKET SIP 22POS GOLD | 2,445 | 16.84 | RFQ |   Datasheet | Bulk | 501 | Active | SIP | 22 (1 x 22) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | 
|   | 28-0501-20CONN SOCKET SIP 28POS TIN | 3,371 | 16.84 | RFQ |   Datasheet | Bulk | 501 | Active | SIP | 28 (1 x 28) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | 
|   | 28-0501-30CONN SOCKET SIP 28POS TIN | 3,522 | 16.84 | RFQ |   Datasheet | Bulk | 501 | Active | SIP | 28 (1 x 28) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | 
|   | 116-41-642-41-003000CONN IC SKT DBL | 3,496 | 16.84 | RFQ |   Datasheet | Tube | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 116-91-642-41-003000CONN IC SKT DBL | 2,915 | 16.84 | RFQ |   Datasheet | Tube | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 714-43-262-31-018000CONN IC DIP SOCKET 62POS GOLD | 2,085 | 16.85 | RFQ |   Datasheet | Bulk | 714 | Active | DIP, 0.1 (2.54mm) Row Spacing | 62 (2 x 31) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 110-11-652-41-001000CONN IC SKT DBL | 3,682 | 16.85 | RFQ |   Datasheet | Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 116-41-950-41-003000CONN IC SKT DBL | 2,155 | 16.85 | RFQ |   Datasheet | Tube | 116 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 116-91-950-41-003000CONN IC SKT DBL | 3,729 | 16.85 | RFQ |   Datasheet | Tube | 116 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 122-11-432-41-001000CONN IC SKT DBL | 2,182 | 16.85 | RFQ |   Datasheet | Tube | 122 | Active | DIP, 0.4 (10.16mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 122-11-632-41-001000CONN IC SKT DBL | 3,719 | 16.85 | RFQ |   Datasheet | Tube | 122 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 



