Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-6508-202

28-6508-202

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,717 16.25

RFQ

28-6508-202

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-302

28-6508-302

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,216 16.25

RFQ

28-6508-302

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
68-PGM11032-10H

68-PGM11032-10H

CONN SOCKET PGA GOLD

Aries Electronics

3,929 16.25

RFQ

68-PGM11032-10H

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
68-PGM11033-10H

68-PGM11033-10H

CONN SOCKET PGA GOLD

Aries Electronics

2,998 16.25

RFQ

68-PGM11033-10H

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
111-93-950-41-001000

111-93-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

3,205 16.25

RFQ

111-93-950-41-001000

Datasheet

Tube 111 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-950-41-001000

111-43-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,027 16.25

RFQ

111-43-950-41-001000

Datasheet

Tube 111 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-064-01-505000

110-91-064-01-505000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,523 16.26

RFQ

110-91-064-01-505000

Datasheet

Tube 110 Active - 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) - - - - 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) - -
104-13-636-41-770000

104-13-636-41-770000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

2,535 16.26

RFQ

104-13-636-41-770000

Datasheet

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
116-41-648-41-007000

116-41-648-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,105 16.27

RFQ

116-41-648-41-007000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-648-41-007000

116-91-648-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,922 16.27

RFQ

116-91-648-41-007000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-132-41-013000

346-93-132-41-013000

SOCKET SLDRLSS PRESSFIT SIP32POS

Mill-Max Manufacturing Corp.

2,293 16.27

RFQ

346-93-132-41-013000

Datasheet

Tube 346 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-328-31-002000

614-41-328-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,700 16.27

RFQ

614-41-328-31-002000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-428-31-002000

614-41-428-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,619 16.27

RFQ

614-41-428-31-002000

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-628-31-002000

614-41-628-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,995 16.27

RFQ

614-41-628-31-002000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-328-31-002000

614-91-328-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,120 16.27

RFQ

614-91-328-31-002000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-428-31-002000

614-91-428-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,612 16.27

RFQ

614-91-428-31-002000

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-628-31-002000

614-91-628-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,701 16.27

RFQ

614-91-628-31-002000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-950-41-001000

115-47-950-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2,671 16.27

RFQ

115-47-950-41-001000

Datasheet

Tube 115 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-952-41-001000

115-93-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

2,251 16.27

RFQ

115-93-952-41-001000

Datasheet

Tube 115 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-952-41-001000

115-43-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,241 16.27

RFQ

115-43-952-41-001000

Datasheet

Tube 115 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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