Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
25-7700-10

25-7700-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,834 16.18

RFQ

25-7700-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7750-10

25-7750-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,070 16.18

RFQ

25-7750-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7770-10

25-7770-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,846 16.18

RFQ

25-7770-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7787-10

25-7787-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,021 16.18

RFQ

25-7787-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7800-10

25-7800-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,569 16.18

RFQ

25-7800-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7846-10

25-7846-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,780 16.18

RFQ

25-7846-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7950-10

25-7950-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,193 16.18

RFQ

25-7950-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
110-13-652-41-001000

110-13-652-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

3,627 16.19

RFQ

110-13-652-41-001000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-648-T-N

APA-648-T-N

ADAPTER PLUG

Samtec Inc.

3,557 16.19

RFQ

Tube APA Active - 48 (2 x 24) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
115-93-650-41-001000

115-93-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

2,901 16.20

RFQ

115-93-650-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-650-41-001000

115-43-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,834 16.20

RFQ

115-43-650-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-324-41-003000

126-93-324-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,469 16.20

RFQ

126-93-324-41-003000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-424-41-003000

126-93-424-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,840 16.20

RFQ

126-93-424-41-003000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-624-41-003000

126-93-624-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,796 16.20

RFQ

126-93-624-41-003000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-324-41-003000

126-43-324-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,457 16.20

RFQ

126-43-324-41-003000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-424-41-003000

126-43-424-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,899 16.20

RFQ

126-43-424-41-003000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-624-41-003000

126-43-624-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,125 16.20

RFQ

126-43-624-41-003000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-3503-20

32-3503-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,928 16.20

RFQ

32-3503-20

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-3503-30

32-3503-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,265 16.20

RFQ

32-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-3551-10

32-3551-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

2,539 16.21

RFQ

32-3551-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
Total 21991 Records«Prev1... 460461462463464465466467...1100Next»
Help you to save your Cost and time.
Help you to save your Cost and time.
Reliable package for your goods.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Fast Reliable Delivery to save time.
Quality premium After-sale service.
Quality premium After-sale service.
Chip Easy Buy (HK) Technology Co.LTD

HOME

Chip Easy Buy (HK) Technology Co.LTD

PRODUCT

Chip Easy Buy (HK) Technology Co.LTD

PHONE

Chip Easy Buy (HK) Technology Co.LTD

USER