Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
24-6556-20

24-6556-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,348 16.18

RFQ

24-6556-20

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
24-6556-30

24-6556-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,583 16.18

RFQ

24-6556-30

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
42-6556-10

42-6556-10

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

3,871 16.18

RFQ

42-6556-10

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
612-43-322-41-003000

612-43-322-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,605 16.18

RFQ

612-43-322-41-003000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-422-41-003000

612-43-422-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,412 16.18

RFQ

612-43-422-41-003000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-322-41-003000

612-93-322-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,245 16.18

RFQ

612-93-322-41-003000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-422-41-003000

612-93-422-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,990 16.18

RFQ

612-93-422-41-003000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-132-41-012000

346-93-132-41-012000

SOCKET SLDRLSS PRESSFIT SIP32POS

Mill-Max Manufacturing Corp.

3,213 16.18

RFQ

346-93-132-41-012000

Datasheet

Tube 346 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
25-71000-10

25-71000-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,096 16.18

RFQ

25-71000-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-71219-10

25-71219-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,840 16.18

RFQ

25-71219-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-71220-10

25-71220-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,915 16.18

RFQ

25-71220-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7350-10

25-7350-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,053 16.18

RFQ

25-7350-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7390-10

25-7390-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,519 16.18

RFQ

25-7390-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7435-10

25-7435-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,438 16.18

RFQ

25-7435-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7450-10

25-7450-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,633 16.18

RFQ

25-7450-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7500-10

25-7500-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,850 16.18

RFQ

25-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7590-10

25-7590-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,352 16.18

RFQ

25-7590-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7625-10

25-7625-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,212 16.18

RFQ

25-7625-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7650-10

25-7650-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,000 16.18

RFQ

25-7650-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7677-10

25-7677-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,367 16.18

RFQ

25-7677-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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