Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
30-3513-11H

30-3513-11H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2,963 16.07

RFQ

30-3513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-11-320-41-001000

612-11-320-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,091 16.07

RFQ

612-11-320-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
315-99-164-41-003000

315-99-164-41-003000

SOCKET LOW PROFILE SIP 64POS

Mill-Max Manufacturing Corp.

3,566 16.07

RFQ

Tube 315 Active SIP 64 (1 x 64) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
37-0508-20

37-0508-20

CONN SOCKET SIP 37POS GOLD

Aries Electronics

3,559 16.08

RFQ

37-0508-20

Datasheet

Bulk 508 Active SIP 37 (1 x 37) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
37-0508-30

37-0508-30

CONN SOCKET SIP 37POS GOLD

Aries Electronics

3,097 16.08

RFQ

37-0508-30

Datasheet

Bulk 508 Active SIP 37 (1 x 37) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
18-6621-30

18-6621-30

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

2,809 16.08

RFQ

18-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-93-640-41-007000

116-93-640-41-007000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

2,751 16.08

RFQ

116-93-640-41-007000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-640-41-007000

116-43-640-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,331 16.08

RFQ

116-43-640-41-007000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-99-164-41-013000

346-99-164-41-013000

CONN SOCKET SIP 64POS TIN-LEAD

Mill-Max Manufacturing Corp.

2,400 16.08

RFQ

346-99-164-41-013000

Datasheet

Tube 346 Active SIP 64 (1 x 64) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-950-41-001000

115-93-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

2,008 16.09

RFQ

115-93-950-41-001000

Datasheet

Tube 115 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-950-41-001000

115-43-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,838 16.09

RFQ

115-43-950-41-001000

Datasheet

Tube 115 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-650-41-007000

116-47-650-41-007000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2,169 16.09

RFQ

116-47-650-41-007000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
26-0501-20

26-0501-20

CONN SOCKET SIP 26POS TIN

Aries Electronics

2,330 16.10

RFQ

26-0501-20

Datasheet

Bulk 501 Active SIP 26 (1 x 26) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
26-0501-30

26-0501-30

CONN SOCKET SIP 26POS TIN

Aries Electronics

3,144 16.10

RFQ

26-0501-30

Datasheet

Bulk 501 Active SIP 26 (1 x 26) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
605-41-328-11-480000

605-41-328-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,730 16.10

RFQ

605-41-328-11-480000

Datasheet

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-428-11-480000

605-41-428-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,217 16.10

RFQ

605-41-428-11-480000

Datasheet

Tube 605 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-628-11-480000

605-41-628-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,896 16.10

RFQ

605-41-628-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-328-11-480000

605-91-328-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,830 16.10

RFQ

605-91-328-11-480000

Datasheet

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-428-11-480000

605-91-428-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,460 16.10

RFQ

605-91-428-11-480000

Datasheet

Tube 605 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-628-11-480000

605-91-628-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,809 16.10

RFQ

605-91-628-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Records«Prev1... 455456457458459460461462...1100Next»
Help you to save your Cost and time.
Help you to save your Cost and time.
Reliable package for your goods.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Fast Reliable Delivery to save time.
Quality premium After-sale service.
Quality premium After-sale service.
Chip Easy Buy (HK) Technology Co.LTD

HOME

Chip Easy Buy (HK) Technology Co.LTD

PRODUCT

Chip Easy Buy (HK) Technology Co.LTD

PHONE

Chip Easy Buy (HK) Technology Co.LTD

USER