Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
114-83-306-41-117101

114-83-306-41-117101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2,827 0.35

RFQ

114-83-306-41-117101

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-306-41-134161

114-83-306-41-134161

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3,263 0.35

RFQ

114-83-306-41-134161

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-308-41-003101

115-87-308-41-003101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,834 0.33

RFQ

115-87-308-41-003101

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-310-41-005101

110-87-310-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,381 0.33

RFQ

110-87-310-41-005101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-610-41-005101

110-87-610-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,402 0.33

RFQ

110-87-610-41-005101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-312-41-001101

110-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2,868 0.33

RFQ

110-87-312-41-001101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-304-41-012101

116-83-304-41-012101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

2,132 0.34

RFQ

116-83-304-41-012101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-009101

116-87-304-41-009101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

2,059 0.34

RFQ

116-87-304-41-009101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-018101

116-87-306-41-018101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3,899 0.34

RFQ

116-87-306-41-018101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-304-41-001101

121-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

3,315 0.35

RFQ

121-83-304-41-001101

Datasheet

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-23/Z-T

AW 127-23/Z-T

SOCKET 23 CONTACTS SINGLE ROW

Assmann WSW Components

2,881 0.37

RFQ

AW 127-23/Z-T

Datasheet

- - Active - - - - - - - - - - - - - -
AW 127-24/Z-T

AW 127-24/Z-T

SOCKET 24 CONTACTS SINGLE ROW

Assmann WSW Components

2,457 0.37

RFQ

AW 127-24/Z-T

Datasheet

- - Active - - - - - - - - - - - - - -
AR 28-HZL/7-TT

AR 28-HZL/7-TT

CONN IC DIP SOCKET 28POS TIN

Assmann WSW Components

3,644 0.38

RFQ

AR 28-HZL/7-TT

Datasheet

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
01-0513-11

01-0513-11

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,850 0.38

RFQ

01-0513-11

Datasheet

Bulk 0513 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-83-308-41-001101

115-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,316 0.44

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-306-41-105161

110-83-306-41-105161

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2,031 0.44

RFQ

110-83-306-41-105161

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-018101

116-87-308-41-018101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,207 0.46

RFQ

116-87-308-41-018101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-007101

116-87-306-41-007101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2,943 0.45

RFQ

116-87-306-41-007101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-314-41-001101

115-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2,095 0.52

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-012-05-001101

510-83-012-05-001101

CONN SOCKET PGA 12POS GOLD

Preci-Dip

3,643 0.52

RFQ

510-83-012-05-001101

Datasheet

Bulk 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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