Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-87-306-41-001101

614-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3,401 0.30

RFQ

614-87-306-41-001101

Datasheet

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-304-41-003101

116-83-304-41-003101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

3,156 0.30

RFQ

116-83-304-41-003101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-304-41-035101

146-87-304-41-035101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

3,578 0.31

RFQ

146-87-304-41-035101

Datasheet

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-304-41-036101

146-87-304-41-036101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

2,421 0.31

RFQ

146-87-304-41-036101

Datasheet

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-306-41-005101

110-83-306-41-005101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3,370 0.33

RFQ

110-83-306-41-005101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-306-41-605101

110-83-306-41-605101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3,586 0.33

RFQ

110-83-306-41-605101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-306-41-001101

612-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3,822 0.31

RFQ

612-87-306-41-001101

Datasheet

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-002101

116-87-304-41-002101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

2,353 0.31

RFQ

116-87-304-41-002101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-21/Z-T

AW 127-21/Z-T

SOCKET 21 CONTACTS SINGLE ROW

Assmann WSW Components

2,298 0.34

RFQ

AW 127-21/Z-T

Datasheet

- - Active - - - - - - - - - - - - - -
02-0518-10

02-0518-10

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,429 0.34

RFQ

02-0518-10

Datasheet

Bulk 518 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-10

02-1518-10

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

3,252 0.34

RFQ

02-1518-10

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-83-306-41-001101

115-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2,975 0.34

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-012-05-001101

510-87-012-05-001101

CONN SOCKET PGA 12POS GOLD

Preci-Dip

3,120 0.32

RFQ

510-87-012-05-001101

Datasheet

Bulk 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-210-41-005101

110-87-210-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,672 0.32

RFQ

110-87-210-41-005101

Datasheet

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-008101

116-87-304-41-008101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

3,999 0.32

RFQ

116-87-304-41-008101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-306-41-105161

110-87-306-41-105161

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3,980 0.42

RFQ

110-87-306-41-105161

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-006101

116-87-306-41-006101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3,905 0.32

RFQ

116-87-306-41-006101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ED028PLCZ-SM-N

ED028PLCZ-SM-N

CONN SOCKET PLCC 28POS

On Shore Technology Inc.

3,585 0.35

RFQ

ED028PLCZ-SM-N

Datasheet

Tube ED Active PLCC 28 (2 x 14) 0.050 (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS)
AW 127-22/Z-T

AW 127-22/Z-T

SOCKET 22 CONTACTS SINGLE ROW

Assmann WSW Components

2,209 0.35

RFQ

AW 127-22/Z-T

Datasheet

- - Active - - - - - - - - - - - - - -
1571994-2

1571994-2

CONN SOCKET SIP 2POS GOLD

TE Connectivity AMP Connectors

2,291 0.35

RFQ

1571994-2

Datasheet

Bulk 510 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester
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