Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-93-424-61-001000

115-93-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,582 21.04

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-624-61-001000

115-93-624-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,582 21.04

RFQ

Tube * Active - - - - - - - - - - - - - -
65-PGM10008-11

65-PGM10008-11

CONN SOCKET PGA GOLD

Aries Electronics

3,164 21.04

RFQ

65-PGM10008-11

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-93-964-41-007000

116-93-964-41-007000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

2,074 21.04

RFQ

116-93-964-41-007000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-964-41-007000

116-43-964-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,877 21.04

RFQ

116-43-964-41-007000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-650-61-001000

110-44-650-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,163 21.04

RFQ

Tube * Active - - - - - - - - - - - - - -
110-99-650-61-001000

110-99-650-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,185 21.04

RFQ

Tube * Active - - - - - - - - - - - - - -
612-43-950-41-004000

612-43-950-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,436 21.07

RFQ

612-43-950-41-004000

Datasheet

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-950-41-004000

612-93-950-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,623 21.07

RFQ

612-93-950-41-004000

Datasheet

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-3551-11

28-3551-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

2,809 21.08

RFQ

28-3551-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3552-11

28-3552-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

3,175 21.08

RFQ

28-3552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3553-11

28-3553-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

3,449 21.08

RFQ

28-3553-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6551-11

28-6551-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

3,718 21.08

RFQ

28-6551-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6552-11

28-6552-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

2,243 21.08

RFQ

28-6552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6553-11

28-6553-11

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2,063 21.08

RFQ

28-6553-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3554-11

28-3554-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

3,587 21.08

RFQ

28-3554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
510-93-025-05-000001

510-93-025-05-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,744 21.08

RFQ

510-93-025-05-000001

Datasheet

Bulk 510 Active PGA 25 (5 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-025-05-000002

510-93-025-05-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,960 21.08

RFQ

510-93-025-05-000002

Datasheet

Bulk 510 Active PGA 25 (5 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-025-05-000003

510-93-025-05-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,567 21.08

RFQ

510-93-025-05-000003

Datasheet

Bulk 510 Active PGA 25 (5 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-C182-20

28-C182-20

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,957 21.10

RFQ

28-C182-20

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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