Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
24-6575-11

24-6575-11

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

3,312 20.98

RFQ

24-6575-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
26-3503-21

26-3503-21

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2,714 20.98

RFQ

26-3503-21

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
26-3503-31

26-3503-31

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

3,634 20.98

RFQ

26-3503-31

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
115-43-420-61-003000

115-43-420-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,026 20.99

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-420-61-003000

115-93-420-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,228 20.99

RFQ

Tube * Active - - - - - - - - - - - - - -
110-91-640-61-001000

110-91-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,063 21.00

RFQ

Tube * Active - - - - - - - - - - - - - -
110-43-316-61-105000

110-43-316-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,631 21.00

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-316-61-105000

110-93-316-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,964 21.00

RFQ

Tube * Active - - - - - - - - - - - - - -
36-6556-11

36-6556-11

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,928 21.02

RFQ

36-6556-11

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
18-3508-21

18-3508-21

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,749 21.02

RFQ

18-3508-21

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3508-31

18-3508-31

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,960 21.02

RFQ

18-3508-31

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
111-43-322-61-001000

111-43-322-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,552 21.04

RFQ

Tube * Active - - - - - - - - - - - - - -
111-43-422-61-001000

111-43-422-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,880 21.04

RFQ

Tube * Active - - - - - - - - - - - - - -
111-93-322-61-001000

111-93-322-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,745 21.04

RFQ

Tube * Active - - - - - - - - - - - - - -
111-93-422-61-001000

111-93-422-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,083 21.04

RFQ

Tube * Active - - - - - - - - - - - - - -
121-11-950-41-001000

121-11-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,180 21.04

RFQ

121-11-950-41-001000

Datasheet

Tube 121 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-324-61-001000

115-43-324-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,653 21.04

RFQ

Tube * Active - - - - - - - - - - - - - -
115-43-424-61-001000

115-43-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,723 21.04

RFQ

Tube * Active - - - - - - - - - - - - - -
115-43-624-61-001000

115-43-624-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,656 21.04

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-324-61-001000

115-93-324-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,110 21.04

RFQ

Tube * Active - - - - - - - - - - - - - -
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