Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-93-318-41-001000

115-93-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

3,217 2.51

RFQ

115-93-318-41-001000

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-324-41-003000

115-43-324-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,975 2.85

RFQ

115-43-324-41-003000

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-628-41-001000

115-93-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2,211 3.44

RFQ

115-93-628-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-318-41-001000

123-43-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

2,082 4.83

RFQ

123-43-318-41-001000

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
14-6511-10

14-6511-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,801 5.25

RFQ

14-6511-10

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
840-AG11D-ESL-LF

840-AG11D-ESL-LF

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

2,913 5.48

RFQ

840-AG11D-ESL-LF

Datasheet

Tube 800 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-950-41-001000

110-43-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

2,774 5.75

RFQ

110-43-950-41-001000

Datasheet

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
22-4518-11

22-4518-11

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,676 4.95

RFQ

22-4518-11

Datasheet

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
ICO-628-CTT

ICO-628-CTT

CONN IC DIP SKT .100

Samtec Inc.

3,188 6.28

RFQ

Tube ICO Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
123-47-640-41-001000

123-47-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

3,372 6.34

RFQ

123-47-640-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ICA-320-SGG

ICA-320-SGG

CONN IC DIP SOCKET 20POS GOLD

Samtec Inc.

3,179 7.15

RFQ

ICA-320-SGG

Datasheet

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled
317-93-121-41-005000

317-93-121-41-005000

CONN SOCKET SIP 21POS GOLD

Mill-Max Manufacturing Corp.

2,274 7.46

RFQ

317-93-121-41-005000

Datasheet

Tube 317 Active SIP 21 (1 x 21) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-324-41-801000

110-13-324-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3,308 7.62

RFQ

110-13-324-41-801000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-93-448-41-005000

117-93-448-41-005000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

2,977 7.64

RFQ

117-93-448-41-005000

Datasheet

Tube 117 Active DIP, 0.4 (10.16mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-320-11-001000

299-93-320-11-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

2,828 7.74

RFQ

299-93-320-11-001000

Datasheet

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
XR2C-3205

XR2C-3205

CONN SOCKET SIP 32POS GOLD

Omron Electronics Inc-EMC Div

2,960 7.77

RFQ

XR2C-3205

Datasheet

Bulk,Box XR2 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
123-93-640-41-001000

123-93-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

2,735 8.78

RFQ

123-93-640-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
D01-9933246

D01-9933246

CONN SOCKET SIP 32POS TIN

Harwin Inc.

3,870 10.58

RFQ

D01-9933246

Datasheet

Bulk D01-993 Active SIP 32 (1 x 32) 0.100 (2.54mm) Tin - Brass Through Hole - Solder Cup 0.100 (2.54mm) Tin - Brass Polyamide (PA46), Nylon 4/6, Glass Filled
TCC03DKSN-S1713

TCC03DKSN-S1713

CONN TRANSIST TO-262 3POS GOLD

Sullins Connector Solutions

2,897 11.24

RFQ

TCC03DKSN-S1713

Datasheet

Tray - Active Transistor, TO-262 3 (Rectangular) 0.150 (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.150 (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS)
80-PGM15059-10

80-PGM15059-10

CONN SOCKET PGA GOLD

Aries Electronics

3,613 16.29

RFQ

80-PGM15059-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Records«Prev1... 5253545556575859...1100Next»
Help you to save your Cost and time.
Help you to save your Cost and time.
Reliable package for your goods.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Fast Reliable Delivery to save time.
Quality premium After-sale service.
Quality premium After-sale service.
Chip Easy Buy (HK) Technology Co.LTD

HOME

Chip Easy Buy (HK) Technology Co.LTD

PRODUCT

Chip Easy Buy (HK) Technology Co.LTD

PHONE

Chip Easy Buy (HK) Technology Co.LTD

USER