Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
550-10-145-15-001101

550-10-145-15-001101

PGA SOLDER TAIL

Preci-Dip

3,593 18.91

RFQ

550-10-145-15-001101

Datasheet

Bulk 550 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
36-6501-21

36-6501-21

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,409 20.00

RFQ

36-6501-21

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-6501-31

36-6501-31

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,264 20.00

RFQ

36-6501-31

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-6621-30

30-6621-30

CONN IC DIP SOCKET 30POS TIN

Aries Electronics

3,091 20.01

RFQ

30-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
123-47-950-41-001000

123-47-950-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3,666 20.01

RFQ

123-47-950-41-001000

Datasheet

Tube 123 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-41-648-41-002000

124-41-648-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,057 20.01

RFQ

124-41-648-41-002000

Datasheet

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-91-648-41-002000

124-91-648-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,285 20.01

RFQ

124-91-648-41-002000

Datasheet

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-13-628-41-801000

123-13-628-41-801000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2,254 20.02

RFQ

123-13-628-41-801000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-324-61-001000

110-41-324-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,414 20.03

RFQ

Tube * Active - - - - - - - - - - - - - -
110-41-424-61-001000

110-41-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,309 20.03

RFQ

Tube * Active - - - - - - - - - - - - - -
110-41-624-61-001000

110-41-624-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,301 20.03

RFQ

Tube * Active - - - - - - - - - - - - - -
110-91-324-61-001000

110-91-324-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,580 20.03

RFQ

Tube * Active - - - - - - - - - - - - - -
110-91-424-61-001000

110-91-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,997 20.03

RFQ

Tube * Active - - - - - - - - - - - - - -
110-91-624-61-001000

110-91-624-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,244 20.03

RFQ

Tube * Active - - - - - - - - - - - - - -
612-41-652-41-004000

612-41-652-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,231 20.03

RFQ

612-41-652-41-004000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-652-41-004000

612-91-652-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,424 20.03

RFQ

612-91-652-41-004000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-308-61-007000

116-43-308-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,424 20.03

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-308-61-007000

116-93-308-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,848 20.03

RFQ

Tube * Active - - - - - - - - - - - - - -
605-41-964-11-480000

605-41-964-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,969 20.03

RFQ

605-41-964-11-480000

Datasheet

Tube 605 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-964-11-480000

605-91-964-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,301 20.03

RFQ

605-91-964-11-480000

Datasheet

Tube 605 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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