Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-43-652-31-012000

614-43-652-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,700 18.10

RFQ

614-43-652-31-012000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-642-41-001000

116-93-642-41-001000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

3,365 18.10

RFQ

116-93-642-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-642-41-001000

116-43-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,725 18.10

RFQ

116-43-642-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-950-31-018000

614-93-950-31-018000

SOCKET CARRIER LOWPRO .900 50POS

Mill-Max Manufacturing Corp.

3,530 18.10

RFQ

614-93-950-31-018000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-950-31-018000

614-43-950-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,475 18.10

RFQ

614-43-950-31-018000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-950-41-003000

116-93-950-41-003000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

2,784 18.11

RFQ

116-93-950-41-003000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-950-41-003000

116-43-950-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,494 18.11

RFQ

116-43-950-41-003000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
22-0503-21

22-0503-21

CONN SOCKET SIP 22POS GOLD

Aries Electronics

3,118 18.11

RFQ

22-0503-21

Datasheet

Bulk 0503 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
22-0503-31

22-0503-31

CONN SOCKET SIP 22POS GOLD

Aries Electronics

3,111 18.11

RFQ

22-0503-31

Datasheet

Bulk 0503 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
37-PGM10012-11

37-PGM10012-11

CONN SOCKET PGA GOLD

Aries Electronics

2,198 18.11

RFQ

37-PGM10012-11

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-13-432-41-001000

612-13-432-41-001000

SOCKET CARRIER SLDRTL .400 32POS

Mill-Max Manufacturing Corp.

3,658 18.12

RFQ

612-13-432-41-001000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-13-632-41-001000

612-13-632-41-001000

SOCKET CARRIER SLDRTL .600 32POS

Mill-Max Manufacturing Corp.

3,694 18.12

RFQ

612-13-632-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-83-304-14-051111

517-83-304-14-051111

CONN SOCKET PGA 304POS GOLD

Preci-Dip

3,498 17.18

RFQ

517-83-304-14-051111

Datasheet

Bulk 517 Active PGA 304 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-420-19-111111

517-87-420-19-111111

CONN SOCKET PGA 420POS GOLD

Preci-Dip

2,408 17.18

RFQ

517-87-420-19-111111

Datasheet

Bulk 517 Active PGA 420 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-175-16-071117

514-83-175-16-071117

CONN SOCKET PGA 175POS GOLD

Preci-Dip

3,546 17.13

RFQ

514-83-175-16-071117

Datasheet

Bulk 514 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
605-93-650-11-480000

605-93-650-11-480000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

2,506 18.13

RFQ

605-93-650-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-650-11-480000

605-43-650-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,892 18.13

RFQ

605-43-650-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
15-0511-11

15-0511-11

CONN SOCKET SIP 15POS GOLD

Aries Electronics

3,940 18.14

RFQ

15-0511-11

Datasheet

Bulk 511 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-211

16-3508-211

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,026 18.14

RFQ

16-3508-211

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-311

16-3508-311

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,308 18.14

RFQ

16-3508-311

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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