Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
122-13-432-41-001000

122-13-432-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

2,771 17.74

RFQ

122-13-432-41-001000

Datasheet

Tube 122 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-13-632-41-001000

122-13-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

2,505 17.74

RFQ

122-13-632-41-001000

Datasheet

Tube 122 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-950-41-007000

116-41-950-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,214 17.75

RFQ

116-41-950-41-007000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-950-41-007000

116-91-950-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,554 17.75

RFQ

116-91-950-41-007000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-650-31-012000

614-93-650-31-012000

SOCKET CARRIER LOWPRO .600 50POS

Mill-Max Manufacturing Corp.

3,129 17.75

RFQ

614-93-650-31-012000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-650-31-012000

614-43-650-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,982 17.75

RFQ

614-43-650-31-012000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
316-93-132-41-003000

316-93-132-41-003000

SOCKET ELEVATED SIP 32POS

Mill-Max Manufacturing Corp.

3,523 17.75

RFQ

316-93-132-41-003000

Datasheet

Tube 316 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-13-322-41-801000

123-13-322-41-801000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

2,670 17.76

RFQ

123-13-322-41-801000

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-636-41-001000

121-13-636-41-001000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

2,779 17.76

RFQ

121-13-636-41-001000

Datasheet

Tube 121 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-93-648-11-480000

605-93-648-11-480000

SOCKET CARRIER LOWPRO .600 48POS

Mill-Max Manufacturing Corp.

3,886 17.78

RFQ

605-93-648-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-648-11-480000

605-43-648-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,094 17.78

RFQ

605-43-648-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-950-41-770000

104-11-950-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,811 17.78

RFQ

104-11-950-41-770000

Datasheet

Tube 104 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-652-11-480000

605-41-652-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,771 17.78

RFQ

605-41-652-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-652-11-480000

605-91-652-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,424 17.78

RFQ

605-91-652-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-640-61-001000

110-13-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,807 17.78

RFQ

Tube * Active - - - - - - - - - - - - - -
3-1437508-1

3-1437508-1

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors

2,763 17.79

RFQ

Bulk,Bulk 8058 Active Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE)
27-7500-10

27-7500-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

2,393 17.80

RFQ

27-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
27-7530-10

27-7530-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

3,675 17.80

RFQ

27-7530-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
27-7550-10

27-7550-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

3,199 17.80

RFQ

27-7550-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
27-7580-10

27-7580-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

2,967 17.80

RFQ

27-7580-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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