| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|   | 20-0508-21CONN SOCKET SIP 20POS GOLD | 3,049 | 16.76 | RFQ |   Datasheet | Bulk | 508 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | 
|   | 20-0508-31CONN SOCKET SIP 20POS GOLD | 2,339 | 16.76 | RFQ |   Datasheet | Bulk | 508 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | 
|   | 26-6823-90CONN IC DIP SOCKET 26POS GOLD | 2,548 | 16.76 | RFQ |   Datasheet | Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 26 (2 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | 
|   | 30-6823-90TCONN IC DIP SOCKET 30POS TIN | 3,722 | 16.76 | RFQ |   Datasheet | Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | 
|   | 110-13-316-61-001000CONN IC SKT DBL | 2,966 | 16.76 | RFQ | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|   | 110-41-316-61-001000CONN IC SKT DBL | 3,664 | 16.76 | RFQ | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|   | 110-43-316-61-001000CONN IC SKT DBL | 3,424 | 16.76 | RFQ | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|   | 110-44-316-61-001000CONN IC SKT DBL | 2,126 | 16.76 | RFQ | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|   | 110-91-316-61-001000CONN IC SKT DBL | 2,357 | 16.76 | RFQ | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|   | 110-93-316-61-001000CONN IC SKT DBL | 3,406 | 16.76 | RFQ | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|   | 110-99-316-61-001000CONN IC SKT DBL | 3,960 | 16.76 | RFQ | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|   | 111-43-316-61-001000CONN IC SKT DBL | 3,583 | 16.76 | RFQ | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|   | 111-93-316-61-001000CONN IC SKT DBL | 2,035 | 16.76 | RFQ | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|   | 115-43-316-61-003000CONN IC SKT DBL | 3,425 | 16.76 | RFQ | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|   | 115-93-316-61-003000CONN IC SKT DBL | 3,020 | 16.76 | RFQ | Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|   | 116-93-328-41-008000CONN IC DIP SOCKET 28POS GOLD | 2,824 | 16.76 | RFQ |   Datasheet | Tube | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 116-93-428-41-008000CONN IC DIP SOCKET 28POS GOLD | 3,063 | 16.76 | RFQ |   Datasheet | Tube | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 116-93-628-41-008000CONN IC DIP SOCKET 28POS GOLD | 2,841 | 16.76 | RFQ |   Datasheet | Tube | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 116-43-328-41-008000CONN IC SKT DBL | 3,017 | 16.76 | RFQ |   Datasheet | Tube | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 
|   | 116-43-428-41-008000CONN IC SKT DBL | 2,562 | 16.76 | RFQ |   Datasheet | Tube | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 



