Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
612-93-624-41-003000

612-93-624-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,101 16.71

RFQ

612-93-624-41-003000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-432-41-002000

126-41-432-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,058 16.71

RFQ

126-41-432-41-002000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-632-41-002000

126-41-632-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,986 16.71

RFQ

126-41-632-41-002000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-93-628-41-002000

124-93-628-41-002000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3,756 16.84

RFQ

124-93-628-41-002000

Datasheet

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-43-328-41-002000

124-43-328-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,822 16.84

RFQ

124-43-328-41-002000

Datasheet

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-43-428-41-002000

124-43-428-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,841 16.84

RFQ

124-43-428-41-002000

Datasheet

Tube 124 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-43-628-41-002000

124-43-628-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,739 16.84

RFQ

124-43-628-41-002000

Datasheet

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-624-41-001000

121-13-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,171 16.86

RFQ

121-13-624-41-001000

Datasheet

Tube 121 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-640-61-001000

110-41-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,638 16.86

RFQ

Tube * Active - - - - - - - - - - - - - -
110-43-640-61-001000

110-43-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,680 16.86

RFQ

Tube * Active - - - - - - - - - - - - - -
110-44-640-61-001000

110-44-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,483 16.86

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-640-61-001000

110-93-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,377 16.86

RFQ

Tube * Active - - - - - - - - - - - - - -
85-PGM11007-10

85-PGM11007-10

CONN SOCKET PGA GOLD

Aries Electronics

3,436 16.62

RFQ

85-PGM11007-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
104-13-328-41-770000

104-13-328-41-770000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2,050 16.62

RFQ

104-13-328-41-770000

Datasheet

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
104-13-428-41-770000

104-13-428-41-770000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3,940 16.62

RFQ

104-13-428-41-770000

Datasheet

Tube 104 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
104-13-628-41-770000

104-13-628-41-770000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3,549 16.62

RFQ

104-13-628-41-770000

Datasheet

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
64-9518-10M

64-9518-10M

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

3,927 16.63

RFQ

64-9518-10M

Datasheet

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
122-13-316-41-801000

122-13-316-41-801000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

2,988 16.63

RFQ

122-13-316-41-801000

Datasheet

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-432-41-003000

612-43-432-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,160 16.63

RFQ

612-43-432-41-003000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-632-41-003000

612-43-632-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,837 16.63

RFQ

612-43-632-41-003000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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