Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
40-6518-10E

40-6518-10E

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,482 14.24

RFQ

40-6518-10E

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3503-20

28-3503-20

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,188 14.24

RFQ

28-3503-20

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-3503-30

28-3503-30

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,493 14.24

RFQ

28-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
58-1518-00

58-1518-00

CONN IC DIP SOCKET 58POS GOLD

Aries Electronics

3,901 14.24

RFQ

58-1518-00

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 58 (2 x 29) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-81000-610C

18-81000-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,028 14.24

RFQ

18-81000-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-81125-610C

18-81125-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,437 14.24

RFQ

18-81125-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-81180-610C

18-81180-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,102 14.24

RFQ

18-81180-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-81240-610C

18-81240-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,198 14.24

RFQ

18-81240-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-81250-610C

18-81250-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,683 14.24

RFQ

18-81250-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8355-610C

18-8355-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,820 14.24

RFQ

18-8355-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8375-610C

18-8375-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,052 14.24

RFQ

18-8375-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8400-610C

18-8400-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,799 14.24

RFQ

18-8400-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8470-610C

18-8470-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,838 14.24

RFQ

18-8470-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8500-610C

18-8500-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,793 14.24

RFQ

18-8500-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8510-610C

18-8510-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,450 14.24

RFQ

18-8510-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8532-610C

18-8532-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,874 14.24

RFQ

18-8532-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8540-610C

18-8540-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,020 14.24

RFQ

18-8540-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8545-610C

18-8545-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,477 14.24

RFQ

18-8545-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8560-610C

18-8560-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,323 14.24

RFQ

18-8560-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8590-610C

18-8590-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,187 14.24

RFQ

18-8590-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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