Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
346-43-139-41-013000

346-43-139-41-013000

CONN SOCKET SIP 39POS GOLD

Mill-Max Manufacturing Corp.

2,151 7.45

RFQ

346-43-139-41-013000

Datasheet

Bulk 346 Active SIP 39 (1 x 39) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
22-4513-10H

22-4513-10H

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,486 7.46

RFQ

22-4513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-81000-310C

08-81000-310C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,975 7.46

RFQ

08-81000-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-81000-610C

08-81000-610C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,417 7.46

RFQ

08-81000-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-81250-310C

08-81250-310C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,163 7.46

RFQ

08-81250-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8240-310C

08-8240-310C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,562 7.46

RFQ

08-8240-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8240-610C

08-8240-610C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,321 7.46

RFQ

08-8240-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8350-310C

08-8350-310C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,920 7.46

RFQ

08-8350-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8370-310C

08-8370-310C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,637 7.46

RFQ

08-8370-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8400-310C

08-8400-310C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,423 7.46

RFQ

08-8400-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8400-610C

08-8400-610C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,204 7.46

RFQ

08-8400-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8415-610C

08-8415-610C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,750 7.46

RFQ

08-8415-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8430-310C

08-8430-310C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,140 7.46

RFQ

08-8430-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8480-310C

08-8480-310C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,448 7.46

RFQ

08-8480-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8500-310C

08-8500-310C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,820 7.46

RFQ

08-8500-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8510-310C

08-8510-310C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,757 7.46

RFQ

08-8510-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8550-310C

08-8550-310C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,326 7.46

RFQ

08-8550-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8560-310C

08-8560-310C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,357 7.46

RFQ

08-8560-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8600-310C

08-8600-310C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,808 7.46

RFQ

08-8600-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8620-310C

08-8620-310C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,968 7.46

RFQ

08-8620-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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