Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
117-87-428-41-105101

117-87-428-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,687 2.51

RFQ

117-87-428-41-105101

Datasheet

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
16-0518-11

16-0518-11

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2,094 2.67

RFQ

16-0518-11

Datasheet

Bulk 518 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-87-640-41-105161

110-87-640-41-105161

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2,408 2.52

RFQ

110-87-640-41-105161

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-320-41-002101

124-83-320-41-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,760 2.70

RFQ

Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-308-T-C

APA-308-T-C

ADAPTER PLUG

Samtec Inc.

3,573 2.70

RFQ

Bulk APA Active - 8 (2 x 4) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-87-328-41-009101

116-87-328-41-009101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,586 2.78

RFQ

116-87-328-41-009101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-009101

116-87-428-41-009101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,211 2.78

RFQ

116-87-428-41-009101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 64-HZL-TT

AR 64-HZL-TT

CONN IC DIP SOCKET 64POS TIN

Assmann WSW Components

3,297 2.70

RFQ

AR 64-HZL-TT

Datasheet

Tray - Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
510-87-084-13-081101

510-87-084-13-081101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

3,851 2.53

RFQ

510-87-084-13-081101

Datasheet

Bulk 510 Active PGA 84 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-610-10-002101

299-83-610-10-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,365 2.54

RFQ

299-83-610-10-002101

Datasheet

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-009101

116-83-422-41-009101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,271 2.54

RFQ

116-83-422-41-009101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-640-31-012101

614-87-640-31-012101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2,263 2.79

RFQ

614-87-640-31-012101

Datasheet

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-430-41-105101

117-83-430-41-105101

CONN IC DIP SOCKET 30POS GOLD

Preci-Dip

3,499 2.55

RFQ

117-83-430-41-105101

Datasheet

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-328-41-012101

116-83-328-41-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,708 2.55

RFQ

116-83-328-41-012101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-632-41-006101

116-83-632-41-006101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3,040 2.79

RFQ

116-83-632-41-006101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-9513-10T

06-9513-10T

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,079 2.72

RFQ

06-9513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-6513-10T

14-6513-10T

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,274 2.72

RFQ

14-6513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-0513-10H

12-0513-10H

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2,133 2.72

RFQ

12-0513-10H

Datasheet

Bulk 0513 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-0518-10H

20-0518-10H

CONN SOCKET SIP 20POS GOLD

Aries Electronics

3,842 2.72

RFQ

20-0518-10H

Datasheet

Bulk 518 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-1518-10H

20-1518-10H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,813 2.72

RFQ

20-1518-10H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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