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Manufacturer	Packaging	Series	ProductStatus	ConvertFrom(AdapterEnd)	ConvertTo(AdapterEnd)	NumberofPins	Pitch-Mating	ContactFinish-Mating	MountingType	Termination	Pitch-Post	ContactFinish-Post	HousingMaterial
3M Analog Devices Inc./Maxim Integrated Aries Electronics Logical Systems Inc. MikroElektronika TE Connectivity Deutsch Connectors	- Bag Box Bulk Bulk,Box Tube	* - 647 Correct-A-Chip® Correct-A-Chip® 1106396 Correct-A-Chip® 1107254 Correct-A-Chip® 1109252 Correct-A-Chip® 1109342 Correct-A-Chip® 1109522 Correct-A-Chip® 1109523 Correct-A-Chip® 1110087 Correct-A-Chip® 1110267-N Correct-A-Chip® 1111163 Correct-A-Chip® 1111841 Correct-A-Chip® 1111903 Correct-A-Chip® 301296 Correct-A-Chip® 301550 Correct-A-Chip® 304235 Correct-A-Chip® 304504 Correct-A-Chip® 304538 Correct-A-Chip® 304633 Correct-A-Chip® 305263 Correct-A-Chip® 305479 Correct-A-Chip® 307349 Correct-A-Chip® 350000 Correct-A-Chip® 351000 Correct-A-Chip® 352000 Correct-A-Chip® 353000 Correct-A-Chip® 354000 Correct-A-Chip® 354W00 Correct-A-Chip® 35W000 Correct-A-Chip® 450001 Correct-A-Chip® 505 Correct-A-Chip® 555000 Correct-A-Chip® 650000 Correct-A-Chip® 651000 Correct-A-Chip® 652000 Correct-A-Chip® 653000 Correct-A-Chip® 655000 Correct-A-Chip® 6645 Correct-A-Chip® 665000 Correct-A-Chip® 666000 Correct-A-Chip® 68340 Correct-A-Chip® 95-132I25 Correct-A-Chip® 96-160M65 Correct-A-Chip® 96-208M50 Correct-A-Chip® 97-56001 Correct-A-Chip® 97-68340 Correct-A-Chip® 97-AQ132D DS9075 Textool™	Active Obsolete	- AT90PWM1 AT90PWM2 DIP, 0.3 (7.62mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing DIP, 0.8 (20.32mm) Row Spacing DIP, 0.9 (22.86mm) Row Spacing DIP, 1.0 (25.40mm) Row Spacing HB2E Relay MSOP Multiple Packages PLCC PQFP QFP SIP Socket, 0.6 (15.24mm) Row Spacing SOIC SOIC-W SOJ SOWIC SSOP TQFP TSOP VQFP	- DIP DIP, 0.3 (7.62mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing DIP, 0.8 (20.32mm) Row Spacing DIP, 0.9 (22.86mm) Row Spacing DIP, 1.0 (25.40mm) Row Spacing JEDEC PGA PLCC QFP SOIC SOWIC	- 10 100 12 128 132 14 144 16 160 169 18 184 20 208 22 24 26 28 32 36 40 42 44 48 52 56 60 64 68 8 80 84 90	- 0.020 (0.50mm) 0.024 (0.60mm) 0.025 (0.64mm) 0.026 (0.65mm) 0.031 (0.80mm) 0.050 (1.27mm) 0.070 (1.78mm) 0.100 (2.54mm)	- Gold Silver Tin Tin-Lead	- Surface Mount Through Hole	- Solder Wire Wrap	- 0.031 (0.80mm) 0.050 (1.27mm) 0.070 (1.78mm) 0.100 (2.54mm)	- Gold Tin Tin-Lead	- Polyamide (PA46), Nylon 4/6, Glass Filled Polyester Polyphenylene Sulfide (PPS) Polysulfone (PSU), Glass Filled

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Photo	Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	ConvertFrom(AdapterEnd)	ConvertTo(AdapterEnd)	NumberofPins	Pitch-Mating	ContactFinish-Mating	MountingType	Termination	Pitch-Post	ContactFinish-Post	HousingMaterial
	PA-SOD6SM18-40 ADAPTER 40SOIC TO 40DIP Logical Systems Inc.	2,146	20.00	RFQ	Datasheet	Bulk	-	Active	SOIC	DIP, 0.6 (15.24mm) Row Spacing	40	0.050 (1.27mm)	-	Through Hole	Solder	0.100 (2.54mm)	-	-
	PA-TS1D6SM18-40 ADAPTER 40TSOP TO 40DIP Logical Systems Inc.	2,603	20.00	RFQ	Datasheet	Bulk	-	Active	TSOP	DIP	40	0.020 (0.50mm)	-	Through Hole	Solder	0.100 (2.54mm)	-	-
	PA-SOD6SM18-44 ADAPTER 44SOIC TO 44DIP Logical Systems Inc.	2,984	22.00	RFQ	Datasheet	Bulk	-	Active	SOIC	DIP	44	0.050 (1.27mm)	-	Through Hole	Solder	0.100 (2.54mm)	-	-
	PA-TS1D6SM18-56 ADAPTER 56TSOP TO 56DIP Logical Systems Inc.	3,581	28.00	RFQ	Datasheet	Bulk	-	Active	TSOP	DIP	56	0.020 (0.50mm)	-	Through Hole	Solder	0.100 (2.54mm)	-	-

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